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主要应用/Application
广泛应用于大功率的高频谐振设备中
Widely used in high power high frequency resonant device
产品特点/Characteristics
电介质：聚丙烯薄膜
结构：双面金属化与金属化膜内串结构
封装：外包阻燃迈拉胶带，阻燃（94V-0级）环氧封装
引出： M6铜螺母或焊片引出
高电压、高频率、高dv/dt特性
能承受大电流
Dielectric：Polypropylene film
Structure: double metal and metal film inner series structure
Coating：Polyester tape wrapping with resin sealing.
Flame retardant execution（UL94V-0）
Terminals：M6 copper nut or lug
High voltage, high frequency, high dv\/dt characteristics
Can withstand high current
技术性能/Specifications
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引用标准/Reference standards
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GB/T 17702 IEC 61071
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工作温度范围/Operating temperature range
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-40℃～85℃
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容量范围/Capacitance
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0.06μF～8μF
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额定电压/Rated Voltage
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1200Vdc～5000Vdc
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容量偏差/Tolerance
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±5%;±10%
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极间耐电压/Test voltage between terminals
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1.5Ur 60s 25℃±5℃
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极壳耐电压/Test voltage between terminals and case
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3000V 50Hz 60s，25℃±5℃
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损耗角正切/Dissipation factor
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tgδ≤10×10-4 at 25℃±5℃，1kHz
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绝缘电阻/Insulation resistance
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C×R≥5000s，at 100Vdc，25℃±5℃，60s
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耐电流冲击能力/Withstand strike current ability
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dv/dt＞1000V/μs
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杂散电感/Stray inductance
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≤30nH
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有效电流/Effective current
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30A～100A
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预期寿命/Life expectancy
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200000h at Ur and 70℃
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